♦ Toll manufacturing of customer formulations (solvent-based and water-based tape casting, screen-printable pastes, inks and pastes for Direct Write 3D printing technologies).
♦ Engineering Consulting services for a wide range of materials processing and development applications (PZT/PLZT piezoceramics, Solid Oxide Fuel Cell (SOFC) materials, Low Temperature Co-fired Ceramics (LTCC), battery electrolytes (LLZO), powdered metallurgy products, ferrites, superconductors, sensor materials, composites and many others).
♦ Process optimization and troubleshooting (formulations, lamination and printing characteristics, dispersions, critical solids loading, green and fired densities, milling and casting parameters, binder burnout and sintering, elimination of defects such as sticking, cracking and warping).
♦ Specialized formulation of ceramic, powdered metal, and composite tapes for sintering in oxygen and inert atmospheres. Expertise with reactive and high-surface area (nano-sized) particle dispersions.
♦ Design and manufacture of advanced LTCC and HTCC ceramic tape systems and multilayer structures (micro-channels, buried cavities, MEMs).
♦ Optimized design and formulation of “thermally fugitive” tape and paste systems.
♦ Rapid prototype design and high-volume 3D Printing of ceramics, metals, and composites.
♦ Customized catalyst supports with engineered lattice structures and complex geometries. Repeatable pore sizes, flow characteristics, and catalyst coverage.
♦ Direct Write pseudoplastic (microextrusion) paste formulation.
♦ Extensive thickfilm ceramic printing, device design, and manufacturing capabilities (heaters, sensors, electronics).
♦ Advanced modeling, analysis, and characterization capabilities for R and D projects (SEM, XRD, COMSOL).